Transparent Film Profiling and Analysis by White Light Scanning Interferometry

Transparent Film Profiling and Analysis by White Light Scanning Interferometry

Authors

DOI:

https://doi.org/10.56741/jnest.v3i03.569

Keywords:

Interferometry, Semiconductor Structure, Surface Profile, Thin Film Measurement, WLSI

Abstract

This paper describes the use of white light scanning interferometry with a Super luminescent diode (SLD) for thin film surface measurement. The technique provides 3D top surface and thickness profiles of transparent films, as well as detailed properties of multilayer film stacks, including material optical properties. The setup involves splitting a laser beam with a beam splitter, generating interference signals detected by a photodetector, and then converting analog signals to digital using an A/D converter for further analysis with LabView and MATLAB software. In this paper, the theoretical analysis and simulation study of white light scanning interferometry for transparent film measurement is discussed. This approach offers a flexible tool for both engineering and structured surface measurements.

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Author Biographies

Nway Nway Hlaing, Yangon Technological University

is a dedicated academic professional currently serving as a Tutor or Demonstrator in the Department of Electronic Engineering at Yangon Technological University (YTU), situated in Gyogone, Insein, Myanmar. With a focus on fostering educational growth and contributing to the field of electronic engineering, she plays a crucial role in the academic and practical training of students at YTU. In this vibrant academic setting, she is involved in a variety of educational activities, including delivering lectures, conducting laboratory sessions, and guiding students through complex engineering concepts and applications. (email: manwaynwayhlaing.ytu@gmail.com).  

Lei Lei Yin Win, Yangon Technological University

is a distinguished Professor in the Department of Electronic Engineering at Yangon Technological University (YTU), located in Gyogone, Insein, Myanmar. With a wealth of experience and expertise in the field of electronic engineering, she contributes significantly to the academic community at YTU through both teaching and research. She is instrumental in shaping the minds of future engineers. Her responsibilities include delivering advanced lectures, overseeing research projects, and mentoring students, thereby fostering a robust academic environment. Her research interests and contributions are well-regarded, making her a valuable resource for students and colleagues. (email: maleileiyinwin.ytu@gmail.com).

Hla Myo Tun, Yangon Technological University

is a Leading Pro-Rector for Research and Engineering Higher Education at Yangon Technological University (YTU), Myanmar. He specializes in professional training for Engineering Higher Education leaders, heads of departments, and faculty members. He also directs Research and Development programs and workshops and has worked as a certified Quality Assurance Evaluator of the Myanmar Engineering Council (MEngC). (email: kohlamyotun.ytu@gmail.com).

Devasis Pradhan, Acharya Institute of Technology

working as an Assistant Professor in Grade 1 and Dean of Research and Development at Acharya Institute of Technology, Bengaluru, Karnataka, from 2017 onwards. His current research includes the effectiveness of 5G Green Communications, mmWave antenna design, UWB antennas, and its implementation. With 16+ years of experience in the Academic and Research field, he has published 76 research papers and eight papers submitted to IEEE Access and Reputed Book and 4 Authored Books and 3 Edited Books (CRC, ISTE, Bentham Science) with a reputed publishing house. (email: devasispradhan@acharya.ac.in).

References

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Published

2024-06-14

How to Cite

Hlaing, N. N., Win, L. L. Y., Tun, H. M., & Pradhan, D. (2024). Transparent Film Profiling and Analysis by White Light Scanning Interferometry. Journal of Novel Engineering Science and Technology, 3(03), 73–78. https://doi.org/10.56741/jnest.v3i03.569

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Vol. 3 No. 03 (2024): Forthcoming Issue - Journal of Novel Engineering Science and Technology

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