Determining the Particle Size of Cu and Ni in Thin Cu/Ni Films using the Williamson-Hall Method

Determining the Particle Size of Cu and Ni in Thin Cu/Ni Films using the Williamson-Hall Method

Authors

DOI:

https://doi.org/10.56741/jnest.v2i01.311

Keywords:

Particle Size, Thin Films, Williamson-Hall Method

Abstract

This research focuses on analyzing the particle size of a thin Cu/Ni layer produced through electroplating by varying the input voltage. The Williamson-Hall method is used to determine the particle size of the layer, and an X-ray diffractometer is used to characterize the layer. The study finds that the particle size of Cu and Ni layers with different applied voltages has different values due to various factors. The optimum voltage for the Ni layer is found to be 7.5 volts, and its overall particle size is 4.13 × 10^(-10) nm, while the particle size of Cu is 5.00 × 10^(-9) nm. The applied voltage affects the particle size produced, and the research identifies an optimum voltage at 7.5 volts.

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Author Biographies

Zulfa ‘Amalia Rahmatika, Universitas Ahmad Dahlan

Zulfa ‘Amalia Rahmatika completed her Bachelor's in Physics Education from Universitas Ahmad Dahlan (Yogyakarta, Indonesia). She has been working as lecturer assistance in the same institution. She can be contacted at: zulfaameliarahamtika@gmail.com.

Moh. Toifur, Universitas Ahmad Dahlan

Dr. Moh. Toifur, M.Si. is the Head of the Master of Physics Education Study Program, Ahmad Dahlan University (Yogyakarta, Indonesia). He holds bachelor's, master's, and doctoral degrees in Physics from Gadjah Mada University, Indonesia. He often receives various research grants from the Ministry of Education and Culture of the Republic of Indonesia. He has also produced many published works in the form of books, proceedings, and journal articles. His email is toifur@fisika.uad.ac.id.

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Published

2023-04-04

How to Cite

Rahmatika, Z. ‘Amalia, & Toifur, M. (2023). Determining the Particle Size of Cu and Ni in Thin Cu/Ni Films using the Williamson-Hall Method. Journal of Novel Engineering Science and Technology, 2(01), 26–33. https://doi.org/10.56741/jnest.v2i01.311

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